Responsibilities:
-Develop and certify wire bond process by characterizing materials, equipment and processes to meet quality, reliability, cost, yield, productivity and engineering lot manufacturability requirements;
-Develop and certify wire bond process by characterizing materials, equipment and processes to meet quality, reliability, cost, yield, productivity and engineering lot manufacturability requirements;
-Train production process engineers and transfer process to high volume manufacturing and provide support in qualification of the new production lines.
Requirements:
-Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline;
-At least 2 years experience in etching process development, prefer Semiconductor manufacture background;
-Efficiency with MS Word, Excel, PowerPoint and Windows preferred;
-Good written and spoken English and Mandarin preferred;
-Excellent communication skills and ability to work with differing personalities;
-Proactive in resolving problems and consistent in following up on open issues;
2219 7985-1|171 3289 5920 63-Ability to work under stress to ensure customer and company goals are achieved.