工作职责:
? Back grind and Wafer Saw Process Improvement(Quality & yield & cost reduction & UPH)
? Back grind and Wafer Saw daily quality case analysis and follow up
? Back grind and Wafer Saw Engineering & qualification lot follow up
? Document Spec review and continue optimization
? Interaction with other departments and customers.
? Provide support on new project introduction
任职资格:
Essential Skills / Attitude
重要的技术／态度
A、外聘：
? >2 years working experience in Back grind, laser groove, wafer saw process
? Familiar with DGP 8760 or 8560 grinder/DFL7160 or 7161 laser saw/ DFD6361 or 6362 wafer saw equipment.
? Advanced in Microsoft office tool(PPT/Word/Excel)
? Fluent in spoken & good command in written English.
? Strong knowledge in 8D report, PFMEA, Control Plan, Process spec, DOE.
6594 7311-|161 1690 9778 53? Strong data analysis skill, SPC.