工作职责：
-Provide feasibility review based on customer requirements.
-Review customer design/spec and provide solution to potential issue.
-Establish and develop new design rule/guideline.
-Provide design schedule and maintain design job cycle time.
-Provide packaging design including generating substrate/leadframe layout drawing, wire bond diagram, package outline drawing and related documents.
-Prepare design feasibility report to review and discuss with package and process engineers.
-Provide on the job training for design staffs and review status.
任职要求：
-Bachelor Degree in Electronics Engineering or equivalent.
-3 years experience in IC BGA substrate/leadframe designs.
-Sound knowledge in IC assembly and substrate/leadframe technologies.
-Strong substrate/leadframe design background.
-Strong understanding in raw materials for substrate/leadframe manufacturing.
-Technical competency in electronic assembly manufacturing process and package constructions.
-Proficient in using AutoCAD, Signity UPD, Cadence APD and CAM350 Gerber tool.
-Good technical communication and presentation skills (Both and Mandarin are preferred).
3164 0275-0|171 3258 7468 98-Effective interpersonal and communication skills.